TLDRs:
- SK Hynix’s market cap reaches 73% of Samsung, narrowing the AI chip gap.
- Strong demand for HBM3E chips boosts SK Hynix stock by 122% recently.
- Samsung begins limited HBM3E and HBM4 shipments, challenging SK Hynix’s lead.
- Advanced packaging growth opens opportunities for equipment and OSAT firms globally.
The semiconductor industry is witnessing a dynamic shift as SK Hynix closes in on Samsung Electronics in the highly competitive AI chip market.
Driven by surging demand for high-bandwidth memory (HBM) chips, SK Hynix has made significant strides, narrowing the market capitalization gap to unprecedented levels.
Market Cap Gap Shrinks Rapidly
As of November 7, SK Hynix’s market capitalization reached 422.2 trillion won (approximately US$290 billion), representing about 73% of Samsung Electronics’ 580.7 trillion won (US$398.9 billion).
Over the past three months, SK Hynix shares have surged an impressive 122%, far outpacing Samsung’s 39% rise. Analysts attribute this rapid ascent to SK Hynix’s early supply of HBM3E chips to Nvidia, which has strengthened its position as a key supplier in the AI sector.
Despite SK Hynix’s gains, foreign investors have shown a mixed response, selling roughly 6.1 trillion won (US$4.2 billion) in SK Hynix shares while simultaneously increasing their holdings in Samsung, highlighting continued confidence in the Korean giant’s long-term competitiveness.
HBM Chips Drive Stock Gains
High-bandwidth memory remains a cornerstone of AI chip performance, and SK Hynix has leveraged its timing advantage to capture significant market share.
In Q2 2025, the company held 62% of the HBM market and continues to be Nvidia’s primary supplier. Samsung, meanwhile, has passed Nvidia’s 12-layer HBM3E validation and plans to begin limited shipments, positioning itself as the third source.
While SK Hynix currently leads in HBM3E production, Samsung is already making strides with its HBM4 technology, reaching speeds of 11 Gbps compared to SK Hynix’s 10 Gbps. Analysts predict that by 2026–2027, Samsung’s production scale, advanced cleanroom capabilities, and sixth-generation 10-nanometer DRAM process could enable it to capture more than 30% market share. Competitive pricing strategies may also help Samsung regain momentum.
Samsung Eyes Next-Gen HBM4
Samsung’s move into HBM4 production reflects a broader strategy to maintain relevance in the AI chip sector.
Limited shipments of HBM4 samples have begun, signaling the company’s intent to challenge SK Hynix’s temporary lead.
For SK Hynix, the race underscores the importance of timing and strong partnerships, particularly with Nvidia, while Samsung’s long-term investment in next-generation processes could reshape market dynamics.
Advanced Packaging Fuels Industry Growth
Beyond HBM production, advanced semiconductor packaging is driving industry growth. Taiwan Semiconductor Manufacturing Co. (TSMC) plans to ramp up Chip on Wafer on Substrate (CoWoS) capacity from 30,000–35,000 wafers per month in 2024 to 75,000–80,000 in 2025, targeting over 100,000 by 2026 with support from outsourced semiconductor assembly and test (OSAT) partners like ASE Technology and Amkor.
Equipment suppliers such as ASMPT, BE Semiconductor Industries (BESI), Onto Innovation, Camtek, and SUSS MicroTec are poised to benefit from rising demand for advanced packaging tools, ranging from hybrid bonders to inspection and metrology systems.
As SK Hynix, Samsung, and Micron expand new HBM packaging sites across South Korea, the US, Taiwan, and Singapore, the industry ecosystem is set for significant growth, creating new opportunities for specialized assembly and test firms.
